Inspection device

ABSTRACT

An inspection device with improved inspection accuracy of electrical characteristics of a component, including a holding table, a pair of measuring elements configured to grip a component held on the holding table  32  and measure electrical characteristics of the component; and a relative movement device configured to relatively move the holding table and the pair of measuring elements. In a state in which component is clamped by the pair of measuring elements, by moving holding table, component and the holding table are separated by at least a set value, and in that state the electrical characteristics are measured. Therefore, even if the holding table is made of a conductive material, effects on the component are reduced, and the electrical characteristics can be measured accurately.

TECHNICAL FIELD

The present application relates to an inspection device for inspectingcomponents mounted on a circuit board.

BACKGROUND ART

Disclosed in patent literature 2 and 3 is an inspection device providedwith a probe that measures electrical characteristics of a component viacontact with the probe. Disclosed in patent literature 1 is aninspection device that measures electrical characteristics of acomponent loaded on a holding table by sandwiching the component fromboth sides. In this inspection device, air is supplied from ventilationduct section 28 along a V-groove in the holding table, and apost-measurement component in the V groove is fed to into introductionopening section 7′. Then, defective components are discarded and goodcomponents are used for mounting on a circuit board.

CITATION LIST Patent Literature

Patent literature 1

JP-S52-30703

Patent literature 2

JP-U-H1-76100

Patent literature 3

WO2014/155657

SUMMARY Problem to be Solved

An object of the present disclosure is to improve measurement accuracyof electrical characteristics in an inspection device capable ofautomatically measuring electrical characteristics of a component.

Means for Solving Problem and Effects

The present disclosure of an inspection device includes: a holdingtable; a pair of measuring elements configured to grip a component heldon the holding table and measure electrical characteristics of thecomponent; and a relative movement device configured to relatively movethe holding table and the pair of measuring elements, wherein theelectrical characteristics are measured in a state with the componentseparated from the holding table and sandwiched by the pair of measuringelements. Because acquisition is performed in a state with the componentseparated from the holding table, effects on the component from theholding table are reduced, and the electrical characteristics can bemeasured accurately.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a perspective view of a mountingmachine including an inspection device that is an embodiment of thepresent disclosure.

FIG. 2 is a perspective view of main sections of the inspection device.

FIG. 3 is a cross section of main sections of the inspection device.

FIG. 4 is a plan view of a portion of the inspection device.

FIG. 5 is a diagram of an air circuit included in the inspection device.

FIG. 6 schematically shows a control device of the mounting machine.

FIG. 7(a) is a flowchart showing an LCR measurement program memorized ona memory section of the control device. FIG. 7(b) is a time chart whenperforming LCR measurement at the inspection device.

FIG. 8 is a flowchart showing a component suitability determinationprogram memorized on the memory section of the control device.

FIG. 9 shows operation of the inspection device. FIG. 9(a) shows aninitial state;

FIG. 9(b) shows a clamped state; FIG. 9(c) shows a measurement state;and FIG. 9(d) shows a discard state.

FIG. 10 is a perspective view of the inspection device seen from adifferent angle than that of FIG. 2.

EMBODIMENTS

A mounting machine including an inspection device that is an embodimentof the present disclosure is described below in detail with reference tothe figures.

The mounting machine shown in FIG. 1 is for mounting components on aboard and includes items such as device main body 2, circuit boardconveying and holding device 4, component supply device 6, and headmoving device 8. Circuit board conveying and holding device 4 conveyscircuit board P (also referred to as board P) in a horizontal state andholds board P, with the conveyance direction of board P in FIG. 1 beingthe x direction, the width direction of board P being the y direction,and the thickness direction of board P being the z direction. The ydirection and the z direction are respectively the front-rear directionand up-down direction of the mounting machine. The x direction, ydirection, and z direction and perpendicular to each other. Componentsupply device 6 supplies electronic components (also referred to ascomponents) s to be mounted on board P and includes items such asmultiple tape feeders 14. Head moving device 8 holds mounting head 16and moves mounting head 16 in the x, y, and z directions; mounting head16 includes suction nozzle 18 that picks up and holds component s.

Reference numeral 20 indicates a camera. Camera 20 captures an image ofa component s held by suction nozzle 18, and based on an image capturedby camera 20, it is determined whether component s is planned to bemounted on circuit board P. Reference numeral 22 indicates an inspectiondevice. Inspection device 22 performs inspection by measuring electricalcharacteristics of component s. Electrical characteristics of components are measured, and it is determined if the measured electricalcharacteristics match information (electrical characteristics) relatedto component s included in the job information, that is, it isdetermined whether the measured electrical characteristics match theelectrical characteristics of the component s planned to be used in thenext work. Electrical characteristics of component s correspond to itemssuch as L (inductance), C (capacitance), R (resistance), and Z′(impedance), and at least one of these is measured by inspection device22.

Inspection device 22 is provided on the main body of circuit boardconveying and holding device 4 via waste box 26. Waste box 26 andinspection device 22 are connected by discard passage 28, and componentss for which the electrical characteristics have been measured are housedin waste box 26 via discard passage 28. Inspection device 22 is providedon waste box 26 such that the height is adjustable. As shown in FIGS. 2and 10, base section 30 is engaged with waste box 26 so as to be able tobe raised and lowered, and main body 29 is fixed to base section 30 byfastening section 31 (refer to FIGS. 3, 4, and 10) that includes boltsand nuts, such that base section 30 and main body section 29 are held soas to be able to be raised and lowered as one body. Also, openings 29 aand 30 a connectable to discard passage 28 are each provided on basesection 30 and main body 29 (refer to FIGS. 3 and 4). As shown in FIGS.2 to 4 and FIG. 10, inspection device 22 includes items such as: (i) theabove main body 29 and base section 30; (ii) holding table 32 capable ofholding component s; (iii) pair of measuring elements formed from fixedelement 34 and movable element 36; (iv) holding table moving device 40that moves holding table 32; (v) movable element moving device 41 thatmoves movable element 36 towards and away from fixed element 34; and(vi) LCR inspection section 42 as an electrical characteristicsinspection section. In the embodiment, component s has electrodes atboth ends so as to be able to be gripped by the pair of measuringelements 37. For example, so-called rectangular chips may apply ascomponent s.

Holding table 32 includes component loading section 44, and loadingsection holding body 46 that holds component loading section 44. Vgroove 44 c is formed in an upper surface of component loading section44 and component s is loaded in V groove 44 c. Because of the V shape,the position of component s is decided accurately. Component loadingsection 44 is conductive and abrasion-resistant, and is manufactured ofa material that does not oxidize easily. Component loading section 44 iselectrically connected to base section 30 via multiple members withconductivity, and by base section 30 being grounded, component loadingsection 44 is also grounded. In the present embodiment, componentloading section 44 contacts loading section holding body 46, and isfixed by fastening section 47, and loading section holding body 46contacts main body 29 via stopper 80 (refer to FIG. 3), and main body 29is fixed to base section 30 by fastening section 31. Further, loadingsection holding body 46, stopper 80, main body 29, base section 30,fastening sections 31 and 47, and the like are conductive. Thus,component loading section 44 is grounded. In this manner, by componentloading section 44 being manufactured from a conductive material andbeing grounded, static charge can be eliminated from a component sloaded on component loading section 44. Also, component loading section44 is manufactured from a material that is abrasion-resistant, so wearon component loading section 44 is curtailed, thus improving durability.Further, because component loading section 44 is manufactured from amaterial which does not oxidize easily, that is, from a material onwhich a passivation film that is an metal oxidation film can be formed,component loading section 44 does not rust easily. Because rust does noteasily get on component s, lowering of the measurement accuracy ofelectrical characteristics of component s is curtailed. For example,component loading section 44 may be manufactured from an aluminum alloyor stainless steel.

Fixed element 34 and movable element 36 each include opposing surfaces34 f and 36 f that oppose each other, and component s is gripped by thispair of opposing surfaces 34 f and 36 f. Fixed element 34 is fixed tomain body 29 via fixed element holding body 55. Moving element 36 isheld to be movable together with movable element holding body 56, and isable to move towards and away from fixed element 34. In the presentembodiment, opposing surface 36 f has a triangular cross section, and ismovable along V groove 44 c. In other words, the shape of opposingsurface 36 f of movable element 36 is formed to substantially correspondto V groove 44 c, and opposing surface 36 f of movable element 36,opposing surface 34 f of fixed element 34, and V groove 44 c of holdingtable 32 are positioned at substantially the same height. Therefore,wherever component s is inside V groove 44 c, the component s can begripped by the pair of opposing surfaces 34 f and 36 f. Also, movableelement 36, in the present embodiment, is a long member stretched in they direction (moving direction), and is held by movable member holdingbody 56 at the retract end. Further, a section further to the rear thanthe leading end section including opposing surface 36 f is formed in ashape without a portion that protrudes in the x direction from theleading end section. Therefore, when holding table 32 and movableelement 36 are moved relatively to each other, holding table 32, in astate in which the bottom section of V groove 44 is positioned abovemovable member 36, is able to move in a forwards direction and abackwards direction with respect to opposing surface 36 f. Further,electric circuit 58 is formed including the pair of measuring elements37 consisting of movable element 36 and fixed element 34, LCR detectionsection 42, a power source device that is not shown, and the like. Whencurrent is supplied between fixed element 34 and movable element 36, thecurrent flowing is detected, and based on this relationship, electricalcharacteristics of component s are measured by LCR detection section 42.LCR detection section 42 is not limited to detecting L, C, and R, LCRdetection section 42 may detect one or more of a physical quantity thatrepresents items such as L, C, R, and Z′. Note that, reference symbols58 a and 58 b of FIGS. 2 to 4 are the connection sections of the pair ofmeasuring elements 37 to electric circuit 58.

Cover section 50 is attached to holding table 32. Cover section 50includes a pair of cover plates 52 and 54 provided spaced apart fromeach other in the x direction at both ends of V groove 44 c. Cover platesections 52 and 54 are each provided on the fixed element 34 side ofholding table 32, and are formed extending in the y direction and zdirection, that is, the moving direction of holding table 32 and movableelement 36 and the vertical direction, and as a plate member that isbent. Cover plate section 52 is channel-shaped when seen in plan view,and includes bottom plate section 52 a and side plate sections 52 b and52 c provided at each side of bottom plate section 52 a spaced apart inthe x direction. Bottom plate section 52 a has a bent lower section soas to form an L-shape when viewed from the side, and an upper sectionthereof is attached to a side surface on the fixed element 34 side ofcomponent loading section 44. Also, at the advanced end position ofholding table 32, a lower section of bottom plate section 52 is abovefixed element holding body 55, side plate section 52 b is positioned tothe outside of fixed element 34 and above fixed element holding body 55,and side plate section 52 c is positioned to the outside of side platesection 52 b and to the outside of fixed element holding body 55. Sideplate section 52 c has a vertical dimension longer than that of sideplate section 52 b, and a lower end section thereof extends close toopening 29 a of main body 29. Cover plate section 54 is attached toloading section holding body 46 on the opposite side of cover platesection 52 with respect to V groove 44 c. Cover plate section 54 ispositioned to the outside of fixed element holding body 55 at theadvanced end position of holding table 32. Cover plate section 54 isformed bent in the vertical direction, and the lower end section thereofextends close to opening 29 a of main body 29. Also, the y directiondimension of cover plate section 54 and side plate section 52 c is asize to cover substantially the whole space in the x direction betweenthe pair of opposing surfaces 34 f and 36 f at least for a period oftime in a case in which fixed element 34 and movable element 36 areseparated from each other. Note that, cover section 50, as describedlater, prevents air from diffusing, and functions to prevent scatteringof components s that have fallen due to the ejection of air.

In a member on the fixed element side (for example, an upper section offixed element 34, a portion of fixed element holding body 55 above fixedelement 34, or main body 29), opening 60 a of air passage 60 facingopposing surface 36 f of movable element 36 is formed. Air passage 60,as shown in FIG. 3, includes air ejection passage 60 s that extendssubstantially in the y direction, internal passage 60 h formed in mainbody 29, and the like. Air ejection passage 60 s extends slanteddownwards the closer it is to movable element 36, and when movablemember 36 is at a position separated from fixed element 34, extensionline k extends in a state reaching above portion R or inside portion Rof opposing surface 36 f of movable element 36. Portion R is a portionwith a high frequency of gripping component s of opposing surface 36 fof movable element 36 and is referred to as a gripping section. Air isapplied diagonally from above to a portion at which extension line k ofopposing surface 36 f intersects. Air cylinders 64 and 70 are connectedto air passage 60. Also, ionizer 62 is provided at the downstream sideof air cylinders 64 and 70 of air passage 60. Ionizer 62 creates acorona discharge to ionize the air, such that ionized air is supplied toopposing surface 36 f.

Holding table moving device 40 includes air cylinder 64 as a drivingsource fixedly provided on main body 29 or base section 30. Piston rod66 (refer to FIG. 5) of air cylinder 64 is connected to loading sectionholding body 46. Air cylinder 64 includes two air chambers, 64 a and 64b, divided by a piston inside the cylinder housing, and electromagneticvalve device 69 is provided between the two air chambers 64 a and 64 b,and air source 68, air passage 60, and a filter (atmosphere).Electromagnetic valve device 69 includes at least one electromagneticvalve, for example, as shown in FIG. 5, a direction changing valve, or avariable valve. The moving direction of loading section holding body 46is controlled by a direction changing valve, and the movement andstopping of loading section holding body 46 is controlled by a variablevalve. Holding table 32 is advanced forwards (moved in the direction ofarrow F in FIG. 3) by air source 68 being connected to air chamber 64 band air passage 60 being connected to air chamber 64 a byelectromagnetic valve device 69, and holding table is retractedbackwards (moved in the direction of arrow B in FIG. 3) by air chamber64 b being opened to the atmosphere and air source 68 being connected toair chamber 64 a by electromagnetic valve device 69.

Movable element moving device 41 includes air cylinder 70 as a drivingsource fixedly provided on main body 29. Movable element holding body 56that is able to be moved together with the movable element is connectedto piston rod 71 of air cylinder 70. Air source 68, air passage 60, anda filter (atmosphere) are connected to two air chambers, 70 a and 70 b,that are divided by a piston inside the housing of air cylinder 70 viaelectromagnetic valve device 72.

Electromagnetic valve device 72 includes at least one electromagneticvalve, for example, a direction changing valve, or a variable valve.Movable element 36 is retracted backwards by air chamber 70 b beingconnected to air passage 60 and air chamber 70 a being connected to airsource 68 by electromagnetic valve device 72, and movable element 36 isadvanced forwards by air chamber 70 a being opened to the atmosphere andair chamber 70 b being connected to air source 68 by electromagneticvalve device 72. In the present embodiment, air supply device 73 isconfigured from items such as air cylinders 64 and 70, air passage 60(including air ejection passage 60 s), opening 60 a, cover section 50,and ionizer 62. Air supply device 73 is also a movable element supplysection and driving source interlinking supply section. Also, opposingsurface 36 f corresponds to a supply target surface. Note that, theconstruction of electromagnetic valve devices 69 and 72 is not limitedto the present embodiment. For example, one three-position valve may beused, or multiple open-close valves may be used. Also, ionizer 62 is notessential.

A pair of guide rods 74 and 75 that extend in the y direction areprovided between movable element holding body 56 and main body 29, and apair of guide rods 76 and 77 that extend in the y direction are providedbetween holding table 32 and movable element holding body 56. An endsection of guide rods 74 and 75 is connected to movable element holdingbody 56, and the other end is slidably engaged with main body 29. Guiderods 76 and 77 are connected to loading section holding body 46 at oneend, and are slidably engaged with movable element holding body 56. Bythese guide rods 74, 75, 76, and 77, holding table 32 and movableelement 36 are relatively movable in the y direction with respect tomain body 29, and moving table 32 and movable element 36 are relativelymovable in the y direction with respect to each other.

Also, as shown in FIG. 3, stopper 82 is provided on the fixed elementside of movable element holding body 56, and stopper 80 is provided on aportion of main body 29 that holds fixed element holding body 55.Stopper 82 regulates how close together movable element holding body 56and holding table 32 (loading section holding body 46) are; stopper 80regulates how close together fixed element 34 (main body 29) and holdingtable 32 (loading section holding body 46) are. In the presentembodiment, guide rods 74 to 77 are shared between holding table movingdevice 40 and movable element moving device 41, and stoppers 80 and 82can be thought of as configuration elements of holding table movingdevice 40. Note that, as shown in FIG. 3, gap Ld between the front endsection of stopper 82 when movable element 36 is at the retract endposition, and loading section holding body 46 when holding table 32 isat the advanced end position is the distance in which relative movementbetween movable element 36 and holding body 32 is allowed.

The mounter includes control device 100. As shown in FIG. 6, controldevice 100 includes controller 102 configured mainly of a computer, andmultiple drive circuits 104. Controller 102 includes items such asexecuting section 110, memory section 112, and input-output section 114,with each of board conveying and holding device 4, component supplydevice 6, and head moving device 8 being connected to input-outputsection 114 via a drive circuit 104, and items such as electromagneticvalve devices 69 and 72 of holding table moving device 40, and movableelement moving device 41 also being connected to input-output section114. Also connected are items such as LCR detection section 42, display116, movable element position sensor 118, holding table position sensor120, and nozzle height sensor 122 for detecting the height of nozzle 18.Memory section 112 stores multiple programs and tables such as the LCRdetection program shown in the flowchart of FIG. 7(a). Also, timemeasurement is performed by timer 124 provided on controller 102. Notethat, in the present embodiment, descriptions are given in a case inwhich overall control of the mounter is performed by control device 100,but control of items such as board conveying and holding device 4,component supply device 6, and head moving device 8 may be performed byindividual control devices.

Operation of the mounter is described below. When changeover and so onis performed, in cases such as when a new tape feeder 14 is set, or whena tape feeder 14 is exchanged, electrical characteristics of thecomponent s held by that tape feeder 14 are measured, and it isinspected whether that tape feeder 14 (or that component s) isappropriate. Also, the inspection result is displayed on display 116. Ifthe result indicates the tape feeder 14 or component s is notappropriate, the tape feeder 14 is replaced.

Electrical characteristics of component s are measured by performing theLCR measurement program shown in the flowchart of FIG. 7(a). Also,movement of holding table 32 and movable member 36 and states of holdingtable position sensor 120 and movable element position sensor 118 areshown in FIG. 7(b). Inspection device 22 is normally in the initialstate shown in FIG. 9(a). Movable element 36 is at the retract endposition and movable table 32 is at the advanced end position, that is,at a position contacting stopper 80. In this state, holding table 32 isin an earthed state due to internal conduction and so on. Movableelement 36 is not above V groove 44 c of holding table 32, so components can be loaded. Also, cover section 50 is positioned on both sides offixed element 34 (separated in the x direction). Movable elementposition sensor 118 and holding table position sensor 120 are both on.In step 1 (hereinafter also referred to as S1, with similar notationused for other steps), it is determined whether an instruction formeasuring electrical characteristics of component s has been output. Ina case in which changeover is performed or the like, an instruction formeasuring electrical characteristics is output. When the measurementinstruction is output, in S2, mounting head 16 is moved, for example,and suction nozzle 18 picks up a component s held by a newly attachedtape feeder 14, and loads the component s on V groove 44 c of holdingtable 32. Suction nozzle 18 is lowered and component s is released suchthat component s is loaded on V groove 44 c.

Then, the fact that suction nozzle 18 has loaded component on V groove44 c and reached the upper limit is detected by nozzle height sensor122, and in S3, movable element 36 is advanced by controllingelectromagnetic valve 72, and movable element position sensor 118 turnsfrom on to off. Opposing surface 36 f of the edge of movable member 36is advanced forwards along V groove 44 c of component loading section44, and component s is clamped by opposing surface 36 f and opposingsurface 34 f of fixed element 34 (refer to FIG. 9[b]). In the presentembodiment, stroke L₁ (refer to FIG. 3) of movable element 36 from theretract end position to the clamping of component s is decided by thesize and so on of the component s to be clamped, and is thus decided inadvance. After advancing of movable element 36 is started, when the timerequired for movable element 36 to advance stroke L₁ has elapsed,advancing of movable member 36 is stopped by performing variablecontrol. The advancing time is measured by timer 124. Holding table 32is at the advanced end position and movable element 36 is advanced, suchthat component s is held in a clamped state by the pair of opposingsurfaces 34 f and 36 f.

In S4, holding table 32 is retracted by control of electromagnetic valvedevice 69, and holding table position sensor 120 is switched from on tooff. Holding table 32 is retracted until contacting with stopper 82(refer to FIG. 9[c]), and is held at that position. The stroke ofholding table 32 between those positions is L₂ (refer to FIG. 3).L₂=Ld−L₁ In the present embodiment, stroke L₂ is equal to or greaterthan set value L_(x)(L₂≥L_(x)), and component loading section 44 isseparated from component s by at least L_(x). When a conductive material(component loading section 44) is positioned near component s whenelectrical properties are being measured, static induction occurs,leading to occurrences of an eddy current or the like, meaning that theelectrical properties cannot be detected correctly. With respect tothis, if component loading section 44 is separated from component s byset value L_(x) or greater (that is, if the minimum distance betweencomponent loading section 44 and component s is set value L_(x) orgreater), measurement errors of the electrical characteristics thatoccur due to component loading section 44 being close to component s canbe reduced. In this manner, set value L_(x) is a distance for whichcomponent loading section 44 has little effect on the measurement ofelectrical characteristics of component s, and is a value acquired byperforming experiments in advance or the like. This state is a measuringstate. Note that, when retracting time which is a time required from thestarting of retracting of holding table 32 to holding table 32retracting stroke L₂ has elapsed, holding table 32 is held in positionby controlling electromagnetic valve device 69. Retracting time Ta ismeasured by timer 124.

In S5, component s is released by suction nozzle 18, and the systemwaits from the time that the component s was loaded on V groove 44 c fora set static elimination time. Each of the components s held by tapefeeder 14 is in an electrified state due to static that occurs becauseof vibration and contact with items that happens during transport bytape feeder 14. Electrified component s has static removed by beingloaded on component loading section 44 that is earthed and made of aconductive material, and due to static discharge into the air. Staticelimination time is the time required to remove the amount of staticelectricity that component s is estimated to have, and is decided byexperiments performed in advance or the like, or is logically decidedbased on the size and specific characteristics of component s. When thetime elapsed since component s was loaded on component loading section44 has reached the de-electrification time, the determination in S5 isyes, and the electrical characteristics of component s are measured inS6. Then, when the measuring time required for measuring the electricalcharacteristics has elapsed, S7 is performed, wherein the measuring timemay be decided based on the type of component or the like, or may be afixed time. In either case, this time is acquired in advance andmemorized.

When the measuring time elapses and measurement of the electricalcharacteristics of component s is complete, in S7, movable element 36 isretracted by control of electromagnetic valve device 72. When theretract end is reached, movable element position sensor 118 turns on. InS8, holding table 32 is retracted by control of electromagnetic valvedevice 69 (refer to FIG. 9[d]). The stroke of holding table 32 in themeasuring state to the retract end position at which movable element 36contacts stopper 82 is _(L.) Therefore, after retract time Tb, which isthe time required for holding table 32 to retract by stroke L_(i), haselapsed, contact with stopper 82 is known. As shown in FIG. 9(d),holding table 32 is positioned further to the rear than opposing surface36 f of movable element 36, and is not below an area between the pair ofopposing surfaces 34 f and 36 f. This is the discard state. When holdingtable 32 is retracted until contacting stopper 82, in S9, by controllingelectromagnetic valve device 69, at air cylinder 64, air chamber 64 b isconnected to air source 68, and air chamber 64 a is connected to airpassage 60. Holding table 32 is advanced and when contacting stopper 80,holding table position sensor 120 turns on. Holding table 32 ispositioned between the pair of opposing surfaces 34 f and 36 f (V groove44 is positioned below opposing surfaces 34 f and 36 f), and there is anempty space above V groove 44 c. Therefore, a component s can be loaded.This is the initial state.

Opposing surface 36 f of movable element 36 moves away from opposingsurface 34 f of fixed element 34, and thus the component s held betweenthem is released. Also, when movable element 36 is retracted, airchamber 70 a of air cylinder 70 is connected to air passage 60, andcover plate sections 52 and 54 are positioned at both ends in the xdirection of the space between the pair of opposing surfaces 34 f and 36f. Further, by holding table 32 being moved behind opposing surface 36 fof movable element 36, it is no longer under the area between the pairof opposing surfaces 34 f and 36 f, and between the pair of opposingsurfaces 34 f and 36 f is connected to openings 29 a and 39 a anddiscard passage 28. In accordance with the retracting of movable element36, air flowing from air chamber 70 a is supplied from opening 60 a fromdiagonally above opposing surface 36 f of movable member 36, and thespace in which air is supplied, that is, the space between the pair ofopposing surfaces 34 f and 36 f is covered from the x direction by coversections 50. Air, after mainly contacting opposing surface 36 f, flowsdown along opposing surface 36 f. Therefore, even if component s were toadhere to portion R without falling from opposing surface 36 f,component s can be made to fall favorably. Also, because air flows in awhirling manner inside cover section 50, component s can be made to falleven if adhering to opposing surface 34 f of fixed element 34. Further,for a component s that falls from opposing surfaces 34 f and 36 f to beloaded on holding table 32, using air to cause the component s to fallmay be considered, but, even in a case in which a component s on Vgroove 44 was not caused to drop by air, the component s would bereliably caused to drop by the advancing of opposing surface 36 f ofmovable element 36 in accordance with the retracting of holding table32. In this manner, in the present embodiment, the discard state can bethought of as a state in which component s drops favorably. Note that,component s that drops from the pair of opposing surfaces 34 f and 36 fis favorably collected in waste box 26 after passing through openings 29a and 30 a and discard passage 28.

Also, providing cover section 50 prevents dropped components s fromscattering. Because side plate section 52 c of cover plate section 52and the lower end section of cover plate 54 extend until near opening 29a of main body 29, component s can be favorably collected in waste box26 after passing from opening 29 a to waste passage 28. On the otherhand, when ionized air is supplied, it is possible to electricallyneutralize opposing surfaces 36 f and 34 f of movable element 36 andfixed element 34, such that the measurement accuracy of the electricalcharacteristics of the next component s can be improved. Further, at aircylinder 64, when holding table 32 is advanced (S9), air chamber 64 a isconnected to air ejection passage 60 s. Also, when transitioning fromthe discard state to the initial state, because air can be supplied toopposing surface 36 f of movable element 36, it is possible to favorablyperform elimination of static on opposing surface 36 f of movableelement 36.

On the other hand, the measured electrical characteristics andelectrical characteristics included in the job information are compared,it is determined whether the component s is the correct component to beused in the subsequent work (job) to be performed, and the determinationresult is displayed on display 116. In S21, measurement values of theelectrical characteristics of the component s are acquired, and in S22,information corresponding to the next job is read from the jobinformation. In S23, these are compared and it is determined whetherthey match. Whether they match or not, the determination result isdisplayed on display 116. In the event that they do not match, work ofexchanging appropriate tape feeders or the like is performed. As givenabove, in the present embodiment, component loading section 44 is madeof conductive material and is grounded. Therefore, before measurement ofelectrical characteristics, elimination of static on component s loadedon component loading section 44 can be performed favorably. On the otherhand, if component s is electrified, it is difficult to measure theimpedance of component s. In contrast, with the present embodiment,because component s is favorably de-electrified, the impedance ofcomponent s can be measured favorably. Further, because component s iscaused to drop into discard passage 28 in parallel with the retractingof movable element 36, compared to performing retraction of the movableelement and discarding of the component s in separate processes, it ispossible to measure the electrical characteristics in a shorter time.

In the above manner, with the present embodiment, the movement controldevice and relative movement control device are configured from itemssuch as: a portion of controller 102 that memorizes S4, S7, and S8 ofthe LCR measurement program; a portion for executing S4, S7, and S8;timer 124; movable element position sensor 118, and holding tableposition sensor 120. Also, the measurement control section is configuredfrom items such as a portion that memorizes S4, and a portion thatexecutes S4; the discard control section is configured from items suchas a portion that memorizes S8, and a portion that executes S8; andpreparation control section is configured from a portion that memorizesS9, and a portion that executes S9. The movement control device is alsothe holding table moving control device and the relative movementcontrol device. Also, air cylinder 70 corresponds to the movable elementcylinder, and air cylinder 64 corresponds to the holding table cylinder.Air supply device 73 is also a movable element supply section anddriving source interlinking supply section. Further, the electricalcharacteristic acquisition device is configured from items such as thepair of measuring elements 37, electrical circuit 58 including LCRdetection section 42, the portion of controller that memorizes S6, andthe portion that executes S6. Further, S3 corresponds to a clampingprocess, S4 and S6 correspond to a measurement process, S7 and S8correspond to a discard process, and S9 corresponds to a preparationprocess.

Note that, it is possible to move both of the measurement elements, andto fix the holding table to the main body. In this case too, the pair ofmeasuring elements can grip component s loaded on the holding table, andby moving the pair of measuring elements, component s can be separatedfrom the holding table by at least a set value. Also, the holding tablemay be movable in a vertical direction. In this case too, with components in a state clamped by the pair of measuring elements, the holdingtable can be separated from component s by at least a set value.Further, the air ejection passage may be provided on a side of main body29 of inspection device 22 in a state with an opening that opensapproximately in the x direction. In other words, one of cover platesections 52 and 54 may be omitted (for example, cover plate section 54),and the air ejection passage with an opening in the x direction may beprovided on that side. As a result, air is supplied towards cover platesection 52 along opposing surfaces 34 f and 36 f (surfaces extending inthe x and z directions), thus component s adhering to the pair ofopposing surfaces 34 f and 36 f can be caused to drop. Also, aftermeasuring the electrical characteristics of component s, holding table32 may be retracted in accordance with the retracting of movable element36 (for example, by performing retraction at the same time). This stateof holding table 32 and movable element 36 may be the discard state.Further, movable element position sensor 118 and holding table positionsensor 120 are not essential. For example, electromagnetic valve devices69 and 72 may be controlled by measurement by timer 124. Also, inaddition to the disclosed embodiments, the present disclosure may bemodified and improved based on knowledge of someone skilled in the art,such as the air supply device is also not essential.

REFERENCE SIGNS LIST

22: inspection device; 26: waste box; 28: discard passage; 29: mainbody; 29 a: opening; 30: base section; 30 a: opening; 31: fasteningsection; 32: holding table; 34: fixed element; 36: movable element; 34f, 36 f: opposing surface; 40: holding table moving device; 41: movableelement moving device; 42: LCR detection section; 44: component loadingsection: 44 c: V groove; 50: cover section; 72: air supply device; 100:control device; 118: movable element position sensor; 118: holding tableposition sensor; 124: timer

(1) An inspection device provided in a mounter that picks up componentssupplied by a component supply device and mounts the components on thecircuit board, the inspection device including:

a holding table capable of holding a component; a pair of measuringelements capable of moving towards and away from each other and capableof measuring electrical characteristics of a component by gripping thecomponent;

a holding table moving device that moves the holding table;

a holding table movement control device that controls the holding tablemoving device, wherein

the holding table movement control device includes a measurement controlsection that, from a clamping state in which the pair of measuringelements grips the component held on the holding table, separates theholding table from the component by at least a set value, thus changingto a measurement state in which it is possible to measure electricalcharacteristics of the component.

The holding table may move in a direction parallel to theapproaching-separating direction of the pair of measuring elements, orin a direction perpendicular to the approaching-separating direction.

The set value, for example, in a case in which the holding table isconductive, may be set such that the holding table is unlikely to affectthe measuring of the electrical characteristics of the component.

(2) The inspection device of (1), wherein the holding table isconductive.

(3) The inspection device of (1) or (2), wherein the pair of measuringelements include a pair of opposing surfaces that oppose each other andthat can contact the component, the component is held by the pair ofopposing surfaces moving closer to each other, the component is releasedby the pair of opposing surfaces moving away from each other, and

the holding table moving device includes a discard control section thatchanges from the measurement state to a discard state in which theholding table is not below the space between the pair of opposingsurfaces that have been separated from each other, by moving the holdingtable.

(4) The inspection device of (3), wherein the holding table movingcontrol device includes a preparation control section that changes fromthe discard state to an initial state in which the holding table canhold the component by moving the holding table below the space betweenthe pair of opposing surfaces that have been separated from each other.

(5) The inspection device of any of (1) to (4), wherein the mounterincludes a discard passage connected to the inspection device, and themain body of the inspection device includes an opening that can beconnected to the discard passage.

At least the position or size of the opening may be decided so as to bein an open state below the space between the pair of opposing surfacesin the discard state.

(6) The inspection device of any of (1) to (5), wherein the inspectiondevice includes an electrical characteristic acquisition section thatsupplies current between the pair of measuring elements, detects thecurrent flowing between the pair of measuring elements and acquires theelectrical characteristics of the component, and

the electrical characteristic acquisition section includes a delay typemeasuring section that starts measuring the electrical characteristicsof the component when at least a set time has elapsed since thecomponent was loaded on holding table.

The set time, for example, may be elimination time required to eliminatestatic from the component. Static elimination time may be decided basedon the component, or may be determined in advance regardless of thecomponent. Note that, time of loading the component on the holding tablemay be considered elimination time.

(7) The inspection device of any of (1) to (6), wherein the pair ofmeasuring elements includes a fixed element that is fixed to a main bodyand a movable element that is relatively movable with respect to thefixed element, and the inspection device includes a movable elementmoving device that moves the movable element with respect to the fixedelement, and a movable element control device that controls the movableelement moving device so as to move the pair of measuring elementstowards and away from each other.

(8) The inspection device of (7), wherein the inspection device includesa connecting mechanism that connects the movable element and the holdingtable in a relatively movable manner.

For example, the movable element may be formed in a rectangular shapeextending in a direction parallel to the movement direction of themovable element. Also, the holding table, when positioned in front ofthe leading end of the movable element, or may be positioned to therear.

(9) The inspection device of any one of (1) to (8), wherein the holdingtable includes a V groove formed with a V-shaped cross section, and thecross section of the leading end section of at least one of themeasuring elements may have a triangular shape corresponding the Vgroove.

(10) An inspection device provided in a mounter that picks up componentssupplied by a component supply device and mounts the components on thecircuit board, the inspection device including:

a holding table capable of holding a component;

a pair of measuring elements capable moving towards and away from eachother and capable of measuring electrical characteristics of a componentby gripping the component;

a relative movement device that relatively moves the pair of measuringelements and the holding table; and

a relative movement control device that controls the relative movementdevice, wherein the relative movement device includes a measurementcontrol section that, from a clamping state in which the pair ofmeasuring elements grips the component held on the holding table,separates the holding table from the component by at least a set value,thus changing to a measurement state in which it is possible to measureelectrical characteristics of the component. With such an inspectiondevice, technology disclosed in any one of (1) to (9) may be applied.

The relative moving device may be (a) a device that fixes the holdingtable and moves the pair of measuring elements, or (b) a device thatfixes one of the pair of the measuring elements and moves the othermeasuring element and the holding table. In the case of (a), forexample, this corresponds to a case in which, in a state with acomponent held by the holding table clamped by the pair of measuringelements, the pair of measuring elements are moved relative to theholding table, and the component and the holding table are separated byat least a set value.

(11) An inspection method for performing inspection related toelectrical characteristics at an inspection device that is provided on amounter that picks up components supplied by a component supply deviceand mounts the components on a circuit board, the inspection deviceincluding (i) a holding table capable of holding the component, and (ii)a pair of measuring elements capable moving towards and away from eachother and capable of measuring electrical characteristics of a componentby gripping the component, the inspection method comprising:

a clamping process by which the pair of measuring elements performsgripping; and

a measurement process in which the holding table is separated from thecomponent gripped by the pair of measuring elements by at least a setamount, and the electrical characteristics of the component aremeasured.

This inspection method may be performed at an inspection device from anyone of (1) to (10).

(12) The inspection method of (11) further including: a discard processin which, after performing the measurement process, the pair ofmeasuring elements are separated from each other, and the holding tableis retracted from a region below between the opposing surfaces of thepair of measuring elements that oppose each other; and

a preparation process in which the holding table is inserted below anarea between the opposing surfaces of the pair of measuring elements,and an initial state is created in which holding the component ispossible. In the discard process, separating of the pair of measuringelements and retracting of the holding table may be performed in order,or may be performed in parallel.

(13) An inspection device included in a mounter that picks up componentssupplied by a component supply device and mounts the components on thecircuit board, the inspection device comprising:

a holding table that is conductive and configured to hold a component;and an electrical characteristic acquisition device configured toacquire electrical characteristics of the component in a state with thecomponent held on the holding table gripped and the component separatedfrom the holding table. With such an inspection device, technologydisclosed in any one of (1) to (12) may be applied.

(14) The inspection device of any one of (1) to (13) wherein, the pairof measuring elements measure electrical characteristics of thecomponent by sandwiching the component between a pair of opposingsurfaces by being brought closer to each other, and release thecomponent from the pair of opposing surfaces by being separated fromeach other, and

the inspection includes an air supply device that in a case in which thepair of measuring elements are separated, supplies air to an air supplytarget surface that is at least one of the pair of opposing surfaces.

A case in which the pair of measuring elements are separated correspondsto a period while separation is occurring, a portion or the entireprocess of separation, during the start of separation, when separationis completed, or the like.

(15) The inspection device of (14) wherein the air supply deviceincludes an ionizer configured to ionize the air, and the ionized sir issupplied to the supply target surface.

(16) The inspection device of (14) or (15) wherein the air supply deviceincludes an air passage that has an opening facing the supply targetsurface.

When the supply target surface is one of the pair of opposing surfaces,one opening is provided facing that supply target surface; when thesupply target surface is both of the pair of opposing surfaces, twoopenings are provided facing each of the supply target surfaces.

(17) The inspection device of (16) wherein the air passage includes anair ejection passage inclined downwards as it approaches the targetsupply surface.

(18) The inspection device of (17) wherein the inclined angle of the airejection passage is an angle such that the air hits above a portion ofthe supply target surface that grips the component.

(19) The inspection device of any one of (14) to (18), wherein the pairof measuring elements includes a fixed element fixed to a main body anda movable element configured to move towards and away from the fixedelement, and

the air supply device includes a movable element supply section thatsupplies the air to the opposing surface of the movable element that isthe supply target surface in a case of the movable element being movedaway from the fixed element.

(20) The inspection device of (19), further including a movable elementmoving device provided with a movable element cylinder that moves themovable element towards and away from the fixed element via operation ofthe movable element cylinder,

wherein

the air supply device includes a drive source interacting supply sectionconfigured to supply air ejected from the movable element cylinder inaccordance with the movable element moving away from the fixed elementto an opposing surface of the movable element.

(21) The inspection device of any one of (1) to (20) including a coversection that is configured to cover a space between the pair of opposingsurfaces that are in a separated state.

The cover section is for covering a large portion of an area between thepair of opposing surfaces, there is no need to cover the entire areabetween the pair of opposing surfaces, and coverage with a gap to acertain extent is acceptable. However, it is desirable that for at leasta point in time when the pair of opposing surfaces are separated for theentire area between the pair of opposing surfaces to be covered fromboth sides.

(22) The inspection device of (21) wherein the cover section is attachedto the holding table, and covers a large portion of the area between thepair of opposing surfaces in a state with the holding table at theretract end position.

1. An inspection device provided in a mounter that picks up componentssupplied by a component supply device and mounts the components on thecircuit board, the inspection device comprising: a holding table capableof holding a component; a pair of measuring elements capable movingtowards and away from each other and capable of measuring electricalcharacteristics of a component by gripping the component; a holdingtable moving device that moves the holding table; a holding tablemovement control device that controls the holding table moving device,wherein the holding table movement control device includes a measurementcontrol section that, from a clamping state in which the pair ofmeasuring elements grips the component held on the holding table,separates the holding table from the component by at least a set value,thus changing to a measurement state in which it is possible to measureelectrical characteristics of the component.
 2. The inspection deviceaccording to claim 1, wherein the pair of measuring elements include apair of opposing surfaces that oppose each other and that can contactthe component, the component is held by the pair of opposing surfacesmoving closer to each other, the component is released by the pair ofopposing surfaces moving away from each other, and the holding tablemoving device includes a discard control section that changes from themeasurement state to a discard state in which the holding table is notbelow the space between the pair of opposing surfaces that have beenseparated from each other, by moving the holding table.
 3. Theinspection device according to claim 2, wherein the holding table movingcontrol device includes a preparation control section that changes fromthe discard state to an initial state in which the holding table canhold the component by moving the holding table below the space betweenthe pair of opposing surfaces that have been separated from each other.4. The inspection device according to claim 1, wherein the pair ofmeasuring elements includes a fixed element that is fixed to a main bodyand a movable element that is relatively movable with respect to thefixed element, and the inspection device includes a movable elementmoving device that moves the movable element with respect to the fixedelement, and a connecting mechanism that connects the movable elementand the holding table such that relative movement in a predetermineddirection is possible.
 5. An inspection device provided in a mounterthat picks up components supplied by a component supply device andmounts the components on the circuit board, the inspection devicecomprising: a holding table configured to hold a component; a pair ofmeasuring elements configured to move towards and away from each otherand to measure electrical characteristics of a component by gripping thecomponent; a relative movement device that relatively moves the pair ofmeasuring elements and the holding table; and a relative movementcontrol device configured to control the relative movement device,wherein the relative movement device includes a measurement controlsection that, from a clamping state in which the pair of measuringelements grips the component held on the holding table, separates theholding table from the component by at least a set value, thus changingto a measurement state in which it is possible to measure electricalcharacteristics of the component.
 6. An inspection method for performinginspection related to electrical characteristics at an inspection devicethat is provided on a mounter that picks up components supplied by acomponent supply device and mounts the components on a circuit board,the inspection device including (i) a holding table capable of holdingthe component, and (ii) a pair of measuring elements capable movingtowards and away from each other and capable of measuring electricalcharacteristics of a component by gripping the component, the inspectionmethod comprising: a clamping process by which the pair of measuringelements performs gripping; and a measurement process in which theholding table is separated from the component gripped by the pair ofmeasuring elements by at least a set amount, and the electricalcharacteristics of the component are measured.
 7. The inspection methodaccording to claim 6, further comprising: a discard process in which,after performing the measurement process, the pair of measuring elementsare separated from each other, and the holding table is retracted from aregion below between the opposing surfaces of the pair of measuringelements that oppose each other; and a preparation process in which theholding table is inserted below an area between the opposing surfaces ofthe pair of measuring elements, and an initial state is created in whichholding the component is possible.